By Chuan Seng Tan, Kuan-Neng Chen, Visit Amazon's Steven J. Koester Page, search results, Learn about Author Central, Steven J. Koester,
Three-dimensional (3D) integration is pointed out as a potential street for non-stop functionality progress in built-in circuits (IC) because the traditional scaling process is confronted with exceptional demanding situations in basic and monetary limits. Wafer point 3D IC can take a number of types, they usually often contain a stack of a number of thinned IC layers which are vertically bonded and interconnected via via silicon through TSV.
There is an extended string of advantages that possible derive from 3D IC implementation corresponding to shape issue, density multiplication, more suitable hold up and gear, more suitable bandwidth, and heterogeneous integration. This booklet provides contributions by way of key researchers during this box, masking motivations, expertise systems, functions, and different layout concerns.
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Similarly, the costs and complexities associated with such fine-grain integration may be quite high for top-down 3D approaches. The cost benefits and trade-offs of such systems is still being studied. The jury is still out. 75in 280711-ch02 System-Level Challenges: The Future of Power-Constrained Processors in 3D Beyond the core and unit/macro levels, the interconnectivity advantages of 3D span the buses at the chip level as well. 11 The interconnect-limited nature of processing can be clearly observed especially in the wire and port-limited blocks like register files in the processing cores.
Today we write programs to figure things like this out. But today we certainly don’t access memory in any manner other than linear. Some new thinking is needed. And finally, we alluded to “future 3D systems” that are not necessarily built as stacks of 2D systems that are (crudely, relative to on-chip wiring) wired together by putting holes through them. If we conceived real 3D systems that were not constrained to be made in accordance with our rich legacy in 2D concepts, designs, and manufacturing flows, what would we come up with?
Building a system in 3D does enable a few specific opportunities. It also requires solving some completely new sets of problems. As will become clearer in this chapter, you should first decide what problems need to be solved by building a system in 3D before figuring out how to go about building it. Without first identifying what it is you think you are improving by using a 3D solution, it is not possible to tailor a 3D solution to your needs. Without first matching the various processes to the application, you will likely work much harder than needed or derive very little benefit from 3D.
3D Integration for VLSI Systems by Chuan Seng Tan, Kuan-Neng Chen, Visit Amazon's Steven J. Koester Page, search results, Learn about Author Central, Steven J. Koester,